Our surface mount assembly capability is built upon our robust New Product Introduction (NPI) process employed for every new product. We perform an automated inspection using a ‘HawkEye’ enabled DEK screen printer to ensure process repeatability during the paste printing operation. During pick & place we present components using tape & reel, JEDEC trays and waffle-packs. Our attention to process control continues through Automatic Optical Inspections (AOI) at both pre-flow and post-flow stages. Solder reflow is performed utilising either a multi-zone convection oven or through a vapour phase reflow (VPR) system.
Surface Mount Assembly (SMA) describes the mounting of electronic components to the surface of a printed circuit board (PCB) in preference to inserting components through holes within the board as is the case with ‘conventional‘ plated through-hole PTH assembly. SMA was originally developed to drive down manufacturing costs and facilitate PCB miniaturisation through increased component density within a given PCB area. The technology continues to promote increasingly complex electronic assemblies leading to ever smaller form factors with the added reliability of process automation.
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QUALITY AND VALUE
Prism Electronics Ltd are committed to;
- Delivering on time and in full following a ‘right first time’ methodology.
- Communicate in a timely and effective manner with our customers and suppliers.
- Strive for zero defects as the only acceptable target through continual improvement.
- Ensuring we operate our business in a professional and ethical manner at all times.