Our surface mount assembly capability is built upon our robust New Product Introduction (NPI) process employed for every new product. We perform an automated inspection using a ‘HawkEye’ enabled DEK screen printer to ensure process repeatability during the paste printing operation. During pick & place we present components using tape & reel, JEDEC trays and waffle-packs. Our attention to process control continues through Automatic Optical Inspections (AOI) at both pre-flow and post-flow stages. Solder reflow is performed utilising either a multi-zone convection oven or through a vapour phase reflow (VPR) system.
Standard package outlines down to 01005(Imp)
Fine pitch placement of micro BGA and QFN
IPC9850 Fine Pitch Repeatability 3σ (X, Y, Theta) – 21μm 0.05˚
IPC9850 Fine Pitch Accuracy @ Cpk 1.33 ((X, Y, Theta) – 35μm 0.09˚
Panel sizes up to 300mm x 410mm
Rigid and Flexi panels, including FR4, Aluminium
Automated component value verification prior to placement
Vapour-Phase or Convection Oven reflow available
Surface Mount Assembly (SMA) describes the mounting of electronic components to the surface of a printed circuit board (PCB) in preference to inserting components through holes within the board as is the case with ‘conventional‘ plated through-hole PTH assembly. SMA was originally developed to drive down manufacturing costs and facilitate PCB miniaturisation through increased component density within a given PCB area. The technology continues to promote increasingly complex electronic assemblies leading to ever smaller form factors with the added reliability of process automation.
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